Halogen free PI reinforcing plate is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to ensure its good adhesion on copper foil and PI material, widely used in various FPC reinforcement.
·產品結構及系列Product Structure and Series
產品結構 Product structure | 產品系列 Product serides |
Pi膜 PI Film 環氧樹脂 Adhesive 離型紙 Release Paper | 環氧膠系列 Epoxy series |
·產品規格 Product Specifications
Item（項目） | Test method（測試方法） | Specification（規格） |
Width（幅寬） | Specification | 250±1mm |
PI stifferner film thickness（PI厚度） | Specification | 3-9 mil |
Adhesive thickness（膠層厚度） | Specification | 25±3um |
Shelf life（保質期） | 25±10℃，65±20﹪RH | 12months |
·產品性能 Product Properties
Item（項目） | Test method（測試方法） | Specification（規格） | |
Adhesive flow(溢膠量) | IPC TM650 2.3.17.1 | ≦0.2mm | |
Peel strength （剝離強度） | As Received（直接測試） | IPC TM650 2.4.9 | ≧0.8kgf/cm |
After MEK/10min (丁酮浸泡10分鐘測試) | ≧0.8kgf/cm | ||
Solder Float Resistance（耐焊性） (after 165℃±5℃ 1hr) ( 165℃±5℃烘烤1小時后) | IPC TM650 2.4.13 | 288℃ 10sec | |
Surface Resistivity（Ω）(表面電阻率) Volume Resistivity（Ω.cm）(體積電阻率) | IPC TM650 2.5.17 IPC TM650 2.5.17 | ≧1.0*1013Ω | |
≧1.0*1015Ω.cm | |||
Insulation Resistance（Ω）(感應電阻率) | IPC TM650 2.6.3.2 | ≧1.0*1011Ω | |
·產品應用 Product Application
用于插拔金手指等部位補強。
The product is mainly used to reinforce parts such as gold finger.