Epoxy resin PI film based FCCL is composed of three kinds of materials, copper foil, adhesive and PI film, which are compounded by high precision coating technology. With high temperature resistance, high insulation, high flexibility and other characteristics. Widely used in FPC manufacturing.
·產品結構及系列Product Structure and Series
產品結構 Product structure | 產品系列 Product serides | |
銅箔 Copper Foil 環氧樹脂 Adhesive Pi膜 PI Film 單面基板 Single-side FCCL | 銅箔 Copper Foil 環氧樹脂 Adhesive Pi膜 PI Film 環氧樹脂 Adhesive 銅箔 Copper Foil 雙面基板 Double-side FCCL | 高撓曲系列 |
LED 系列 | ||
BGA系列 | ||
·產品規格 Product Specifications
Item（項目） | Test method（測試方法） | Specification（規格） |
Width（幅寬） | Specification | 250±1mm |
Polyimide thickness（PI厚度） | Specification | 12.5um、25um |
Adhesive thickness（膠層厚度） | Specification | 13-25um |
Copper thickness（銅箔厚度） | Specification | 12.5um、18um、35um |
Shelf life(保質期) | 25±10℃，65±20﹪RH | 12months |
·產品性能 Product Properties
Item（項目） | Test method（測試方法） | Specification（規格） | ||
Peel strength （剝離強度） | As Received（直接測試） | IPC TM650 2.4.9 | ≧0.8kgf/cm | |
After MEK/10min (丁酮浸泡10分鐘測試) | ≧0.8kgf/cm | |||
Solder Float Resistance（耐焊性） (after 165℃±5℃ 1hr) ( 165℃±5℃烘烤1小時后) | IPC TM650 2.4.13 | 288℃ 10sec | ||
Dimensional stability（尺寸穩定性） | IPC TM650 2.2.4 | TD≦±0.2% | ||
MD≦±0.2% | ||||
Chemical resistance （耐化學品性） | MEK 5min（丁酮浸泡5分鐘測試） | IPC TM650 2.3.2 | No evident of defects | |
HCl 5% 5min（5%鹽酸溶液浸泡5分鐘測試） | ||||
NaOH 5% 5min（5%氫氧化鈉溶液浸泡5分鐘測試） | ||||
Surface Resistivity（Ω）(表面電阻率) | IPC TM650 2.5.17 | ≧1.0*1013Ω | ||
Volume Resistivity（Ω.cm）(體積電阻率) | IPC TM650 2.5.17 | ≧1.0*1015Ω.cm | ||
Insulation Resistance（Ω）(感應電阻率) | IPC TM650 2.6.3.2 | ≧1.0*1011Ω | ||
·產品應用 Product Application
該系列產品廣泛應用于FPC制造。
This series of products are widely used in FPC manufacturing.